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Stock List Crystals & Substrates

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SurfaceNet GmbH Germany (Crystals, Substrates, Service)
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CMP Systems

CMP (chemical mechanical polishing) systems are offered in 1-, 2- and 4-stations systems.
A special bearing system is used to keep the polishing plate with the polishing pad non bowed.

The construction is a heavy build quality to avoid vibrations and deformations.

With this system all kind of materials can be polished to epitaxial quality.

Oxide materials (like Sapphire) can be polished up to 6 and a roughness of 0,5 lattice
constant or better (for Sapphire e.g. 0,21 nm (ra) on a 10 x 10 m AFM scan).

We offer also the needed technology for several materials to polish and also the needed carriers and tools